Magnetron cathode sputtering apparatus
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United States of America Patent
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-
Aug 21, 1984
Grant Date -
N/A
app pub date -
Oct 11, 1983
filing date -
Oct 11, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A magnetron cathode sputtering apparatus including a pair of rotary cylindrical sputtering targets mounted in spaced parallel relation in an evacuable coating chamber and separate magnetic means located within said targets, the magnetic means being oriented relative to one another such that the material sputtered therefrom will be directed inwardly and downwardly at an acute angle whereby the sputtered material from the two targets will be focused upon the substrates.
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