Solderless connection technique and apparatus
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United States of America Patent
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-
Aug 28, 1984
Issued Date -
N/A
app pub date -
Apr 30, 1979
filing date -
May 22, 1978
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Contact portions of a first array of conductive elements are urged against mating contacts of a second array by a pressure applicator comprising a resilient open celled plastic material to establish and maintain an electrical connection therebetween.
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