Composition for bonding electroconductive metal coating to electrically nonconductive material
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United States of America Patent
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Sep 4, 1984
Grant Date -
N/A
app pub date -
Sep 2, 1983
filing date -
Sep 2, 1983
priority date (Note) -
Expired
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Abstract
This invention provides a composition comprising about 15 to about 75% by weight of a thermosetting or ultraviolet-curable resin, about 24.5 to about 84.5% by weight of finely divided heat-resistant inorganic substance and about 0.5 to about 20% by weight of a finely divided palladium catalyst. This composition is the solvent-free type and useful for forming an electroconductive metal coating on an electrically nonconductive base material by chemical plating.
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