Laser assisted saw device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4469931
SERIAL NO

06417511

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method and apparatus for eliminating chipping at the exit surface of a saw blade through material such as wood or the like, the apparatus including a laser source emitting a laser beam which is focused to provide one or more grooves at the surface of the wood in general alignment with the line of cut in advance thereof. In a first embodiment a single groove is formed by a focused laser beam at a spot just ahead of the saw blade which may be positioned for one edge of the teeth thereof cutting through the center of the groove to produce one finished cut edge. In the other embodiments, two focused beams are created from a single beam for producing parallel grooves at a width approximating the width of cut of the saw blade to produce finished edges on both sides of the saw cut.

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Patent Owner(s)

  • MACKEN LASER, INC. A CA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Macken, John A 4039 Shadow Hill Dr., Santa Rosa, CA 95404 25 526

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