Dustfree packaging container and method

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United States of America Patent

PATENT NO 4470508
SERIAL NO

06524855

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Abstract

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A dust and contamination free packaging container is provided. A method of producing contamination free packaging is also included. The package includes mating exterior frame members and spacing blocks for displacing a packaged product from the interior walls of the frame. The interior frame surfaces are coated with a contact adhesive which captures and retains particulate matter with which it comes into contact. Prior to use the contact adhesive surfaces are protected by cover sheets or elements which are readily removed at the time the product is to be inserted into the container. The predominant usage of the containers and method is in the electronic and optical industries and particularly in the packaging of photomask pellicles.

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Patent Owner(s)

Patent OwnerAddress
YEN YUNG-TSAI1192 ST ANTHONY COURT LOS ALTOS CA 94002

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Yen, Yung-Tsai Los Altos, CA 13 238

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