Additive printed circuit process
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United States of America Patent
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-
Sep 11, 1984
Grant Date -
N/A
app pub date -
May 2, 1983
filing date -
May 2, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Electrical conductors having enhanced resolution/spacing and adhesion characteristics are prepared by applying a mixture of a carbonyl-processed nickel powder and a polymer to a substrate, curing the polymer, and immersing the cured polymer pattern in an augmentative-replacement/electroplating bath, to effect an augmentative replacement reaction to form a contiguous layer of conducting metal on the substrate and thereafter electroplating an additional metal layer on the contiguous layer.
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