Importance

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Abstract

The specification describes a unitary probe assembly adapted to inspect semiconductor chips each provided with a plurality of electrode terminals at both inner surface area and outer peripheral edge thereof. Probes are disposed in a plurality of layers and terminate at the free ends thereof in a common plane. The main body portions of the probes are covered by a layer of an insulating material. Owing to the layer of the insulating material, the layers of the probes can be stacked closely without need to worry about their electrical contact, thereby making it possible to reduce the assembly in thickness and rendering its handling and application easier. Since all the probes are disposed at once and secured in place with a suitable resin such as epoxy resin, the fabrication of the probe assembly is easy and efficient.

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First Claim