Pattern forming apparatus

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United States of America Patent

PATENT NO 4480910
SERIAL NO

06358436

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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There is disclosed a pattern forming apparatus for projecting a pattern which is formed on a reticle upon a photoresist layer on a substrate which comprises an illumination system for illuminating the pattern for forming an optical image, a reduction lenses for reducing the optical pattern image at a certain reduction ratio and projecting the reduced optical pattern image upon the photoresist layer formed on the substrate for exposing the photoresist layer, and liquid sustaining means for filling a gap between at least a portion of the reduction lenses and the photoresist layer with an optically transparent liquid having a refractive index of more than 1 (one).

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Patent Owner(s)

Patent OwnerAddress
HITACHI LTD A CORP OF JAPAN6 KANDA SURUGADAI 4-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akeyama, Masamoto Kokubunji, JP 3 1474
Harada, Tatsuo Fuchu, JP 33 1510
Hosaka, Sumio Hachioji, JP 70 2626
Kawamura, Yoshio Tokyo, JP 48 2888
Kondo, Yataro Koganei, JP 1 1003
Kuniyoshi, Shinji Tokyo, JP 28 1563
Kurosaki, Toshiei Tokyo, JP 32 1637
Takanashi, Akihiro Kokubunji, JP 11 1265

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