Encapsulating composition for inductive devices containing elastomeric polybutadiene having predominate trans-1,4 configuration
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Nov 27, 1984
Grant Date -
N/A
app pub date -
Feb 18, 1982
filing date -
Feb 18, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Encapsulating compositions for inductive devices have a polybutadiene base, predominate in trans-1,4 polybutadiene, and include cis-1,4 polybutadiene and vinyl-1,2 polybutadiene, together with an initiator, an inhibitor and a co-agent for improving the curing of the composition. The compositions are usable at higher temperatures, based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature soft cure encapsulation is achieved from which an inductive device may be liberated without damage to the device.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully