Electrical conductor
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United States of America Patent
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Dec 11, 1984
Issued Date -
N/A
app pub date -
Jan 28, 1983
filing date -
Dec 29, 1980
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A low-cost conductor, e.g. a printed circuit, is prepared by applying a mixture of a metallic powder and polymer on a substrate and curing the polymer, followed by an augmentation replacement reaction being effected to replace some of the metallic powder with a more noble metal in such a way that the total volume of deposited metal on the surface exceeds that of the original metal powder at that surface. This procedure produces a contiguous layer of conducting metal on the substrate. The conductors thus formed can easily be soldered without leaching using conventional tin-lead solders.
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