Method for simulating and testing an integrated circuit chip

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4488354
SERIAL NO

06321370

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A method and apparatus for simulating custom chips to be used in a data processing system. Each chip is simulated by a chip simulator that includes a mother board and a plurality of baby boards mounted and interconnected on the mother board. Each baby board has circuit components mounted thereon for performing the circuit function of one cell of the chip. Chip simulators are interconnected in an interconnecting apparatus that supports the mother boards in parallel and spaced apart relation. Chip simulators that represent all of the chips found on a single printed circuit board in the system are interconnected at the interconnecting apparatus so that design errors which are only evident when the chips are interconnected can be tested for and detected prior to fabrication of the chips.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRONICS CO LTD A CORP OF REPUBLIC OF KOREASAMSUNG MAIN BLDG 250 TAEPYUNG-RO 2-KA CHUNG-KU SEOUL

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Kasun K Del Mar, CA 2 82
Erickson, Gerald J San Diego, CA 1 61
Schuck, David B Escondido, CA 10 468
Stone, James W Escondido, CA 18 309

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation