Thermoelectric device and method of making and using same
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United States of America Patent
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Dec 25, 1984
Grant Date -
N/A
app pub date -
Jul 21, 1983
filing date -
Jul 21, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An invention is disclosed which provides improved thermoelectric devices and methods of making and using the same. The device exhibits enhanced efficiency and operating life through the use of a bonding material comprising at least 75% busmuth together with an adherent metallic layer interposed between the boundary structure and correspondary thermoelectric semiconductor element.
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