Method of manufacturing thin film circuits

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United States of America Patent

PATENT NO 4496435
SERIAL NO

06577821

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A thin film circuit including resistor elements and capacitor elements is prepared by forming a tantalum film for capacitor on an insulating substrate, forming a tantalum film for resistor over the substrate, covering a predetermined region of the tantalum resistor film with a titanium film, heat treating a resulting assembly, removing the titanium film, and then covering the predetermined region with a metal film to provide ohmic contact therebetween.

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Patent Owner(s)

  • NEC CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Harada, Keiji Tokyo, JP 11 51
Sato, Akio Tokyo, JP 82 671

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