Curable resin composition
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United States of America Patent
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-
Jan 29, 1985
Grant Date -
N/A
app pub date -
Feb 24, 1982
filing date -
Feb 28, 1981
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A curable resin composition comprising: (a) a polyphenylene ether resin, (b) a maleimide component and/or a cyanate ester component, and (c) an epoxy compound is disclosed. The cured resin composition can give a cured resin having resistance to heat, solvent and moisture, adhering property and electrical properties.
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