Thermoelectric device exhibiting decreased stress
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United States of America Patent
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Feb 5, 1985
Grant Date -
N/A
app pub date -
Feb 28, 1983
filing date -
Feb 28, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A thermoelectric device exhibiting both structural integrity and decreased stress across the device notwithstanding the application of thermally cycled temperature differentials thereacross includes, electrically interconnected thermoelectric elements and a rigidly affixed substrate. Thermal stress is relieved by using flexible conductors to interconnect the thermoelectric elements, and by the use of a flexile joint to attach a second substrate to the remainder of the device. Complete elimination of the second substrate may also be used to eliminate stress. Presence of the rigidly affixed substrate gives the device sufficient structural integrity to enable it to withstand rugged conditions.
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