Apparatus for and method of controlling sputter coating
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United States of America Patent
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Feb 19, 1985
Issued Date -
N/A
app pub date -
Dec 27, 1983
filing date -
Jul 19, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The magnetic field of a magnetron sputter coating apparatus is controlled in response to measurements of plasma parameters to control deposition parameters, such as sputter deposition rate and material deposition thickness profile. From time to time the apparatus is standardized to change preset values for parameters of the plasma to manage the deposition parameters.
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