Wafer exposure method and apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 19, 1985
Grant Date -
N/A
app pub date -
Sep 22, 1982
filing date -
Sep 22, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Provided are a wafer exposure method and apparatus wherein a mask of a desired chip pattern is exposed in a reduced scale onto a wafer coated with a resist film, and a number of resist patterns are transferred onto the resist film by the step and repeat method. During the transfer of the resist pattern, the thickness of the resist film is measured, and the exposure is controlled according to the measured thickness of the resist film.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully