Bondable polyamide
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United States of America Patent
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-
Mar 19, 1985
Grant Date -
N/A
app pub date -
Sep 28, 1982
filing date -
Sep 28, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acids and one or two aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester-imide, or polyamide-imide.
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