Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
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United States of America Patent
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-
Mar 26, 1985
Grant Date -
N/A
app pub date -
Feb 25, 1982
filing date -
Mar 5, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor. An external lead of a lead frame extends to one side of a substrate support serving as a heat sink and supporting a semiconductor substrate, and strips of the lead frame extend to the other end of the substrate support. The external lead and strips are clamped by upper and lower molds for plastic encapsulation, so that a thin film of plastic is uniformly formed on a lower surface of the substrate support. A connecting portion between the external lead and a connecting band and the strips extending from a plastic encapsulating housing to the outside are cut.
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