Protection of semiconductor wire bonding capillary from spark erosion
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United States of America Patent
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Apr 23, 1985
Grant Date -
N/A
app pub date -
Jan 3, 1983
filing date -
Jan 3, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A wire bonding capillary of a hard, normally electrically non-conductive material wherein surfaces of the capillary are coated with a thin electrically conductive material for protecting the capillary bonding face from spark erosion damage and reduction in carbon-like material build-up inside the inner taper of the capillary bore by conduction of current from an electronic flame-off (EFO) torch through a low resistance path to ground.
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