Metallization and bonding means and method for VLSI packages
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United States of America Patent
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-
Apr 23, 1985
Grant Date -
N/A
app pub date -
Jun 15, 1983
filing date -
Jun 15, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved VLSI device package and an improved method for contacting VLSI devices, in which the occurrences of wire bond shorts and lead voltage drops are substantially reduced, are obtained by providing multiple lead levels in the package, with the N.sub.2 leads on the upper lead level grouped into N.sub.3 bunches separated by N.sub.4 spaces, where each of the N.sub.4 spaces aligns with a bonding target on a corresponding one of the N.sub.1 leads on the lower level leads of the package, and where N.sub.1
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