Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4513544
SERIAL NO

06487200

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Abstract

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Crystalline rods or blocks can be sawed into thin wafers by sawing the rodr block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WACKER-CHEMITRONIC GESELLSCHAFT FUR ELEKTRONIK GRUNDSTOFFE MBHBURGHAUSEN0

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lossl, Gunter Kirchweidach, DE 2 48
Stock, Horst Burghausen, DE 4 58
Zauhar, Helmut Burghausen, DE 3 55

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (5)
6493934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
* 2004/0031,476 Group encapsulated dicing chuck 1 2003
* 2005/0186,761 Group encapsulated dicing chuck 0 2005
* 2007/0068,504 Group encapsulated dicing chuck 1 2006
* 2007/0062,511 Group encapsulated dicing chuck 0 2006
 
SHARP KABUSHIKI KAISHA (1)
* 7637801 Method of making solar cell 1 2006
 
WACKER SILTRONIC GESELLSCHAFT FUR HALBLETERMATERIALIEN AG (1)
* 4844047 Process for sawing crystal rods or blocks into thin wafers 17 1987
 
U.S. PHILIPS CORPORATION (1)
* 4826143 Method of manufacturing a spring of the cylindrical type to be used at high temperature 4 1988
 
MICRON TECHNOLOGY, INC. (16)
* 6250192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 14 1996
* 6155247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
6196096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6401580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6255196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6279563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6427676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 15 2001
6631662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6459105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6423616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6691696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 7 2001
6578458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 18 2002
6687990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6897571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 1 2002
6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7387119 Dicing saw with variable indexing capability 0 2005
 
Wacker Chemitronics GmbH (1)
* 4834062 Multiblade inner hole saw for the sawing of crystal rods into thin blades 3 1988
 
GEBRUDER LINCK MASCHINENFABRIK "GATTERLINCK" GMBH & CO. KG, APPENWEIERER STRASSE 46, OBERKIRCH, WEST GERMANY A CORP OF GERMANY (1)
* 5027517 Circular saw head 2 1989
* Cited By Examiner