US Patent No: 4,513,544

Number of patents in Portfolio can not be more than 2000

Method of sawing crystalline rods, and multiple-blade internal-hole saw for carrying out the method

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Abstract

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Crystalline rods or blocks can be sawed into thin wafers by sawing the rodr block into a plurality of wafers that are connected to each other. The wafers can be connected by introducing a connecting agent after each sawing step, into the resulting cutting gaps. The wafers are separated only after the whole rod has been sawed. The method makes possible the use of multiple-blade internal-hole saws, and preferably two-blade internal-hole saws.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
WACKER-CHEMITRONIC GESELLSCHAFT FUR ELEKTRONIK GRUNDSTOFFE MBHBURGHAUSEN27

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lossl, Gunter Kirchweidach, DE 2 48
Stock, Horst Burghausen, DE 4 55
Zauhar, Helmut Burghausen, DE 3 55

Cited Art Landscape

Patent Info (Count) # Cites Year
 
RCA Corporation (2)
4,228,782 System for regulating the applied blade-to-boule force during the slicing of wafers 19 1978
4,227,348 Method of slicing a wafer 23 1978

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
MICRON TECHNOLOGY, INC. (16)
6,250,192 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1996
6,155,247 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 13 1999
6,196,096 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 8 1999
6,401,580 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 12 2000
6,255,196 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 4 2000
6,279,563 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2000
6,427,676 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 14 2001
6,631,662 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 2 2001
6,459,105 Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions 3 2001
6,423,616 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001
6,691,696 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 5 2001
6,578,458 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 10 2002
6,687,990 Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby 6 2002
6,897,571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2002
6,932,077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus 2 2003
7,387,119 Dicing saw with variable indexing capability 0 2005
 
GEBRUDER LINCK MASCHINENFABRIK, "GATTERLINCK" GMBH & CO. KG, APPENWEIERER STRASSE 46, D-7602 OBERKIRCH, FED. REP. OF GERMANY A CORP. OF THE FED. REP. OF GERMANY (1)
5,027,517 Circular saw head 2 1989
 
SHARP KABUSHIKI KAISHA (1)
7,637,801 Method of making solar cell 1 2006
 
U.S. PHILIPS CORPORATION (1)
4,826,143 Method of manufacturing a spring of the cylindrical type to be used at high temperature 4 1988
 
Wacker Chemitronics GmbH (1)
4,834,062 Multiblade inner hole saw for the sawing of crystal rods into thin blades 3 1988
 
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMATERIALIEN AKTIENGESELLSCHAFT (1)
4,844,047 Process for sawing crystal rods or blocks into thin wafers 17 1987
 
Other [Check patent profile for assignment information] (1)
6,493,934 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions 0 2001