Consolidation of wires by chemical deposition and products resulting therefrom
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United States of America Patent
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May 21, 1985
Grant Date -
N/A
app pub date -
Sep 28, 1982
filing date -
Sep 28, 1982
priority date (Note) -
Expired
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Abstract
Electrically conductive bodies and methods of using same are disclosed which generally incorporate the feature of wire crossing wire at multiple sites of mutual contact throughout the body with the wire interconnected at the sites by a chemical deposition of metal to yield a rigid, open metallic lattice.
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