Selective removal of coating material on a coated substrate
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United States of America Patent
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May 21, 1985
Grant Date -
N/A
app pub date -
Dec 16, 1983
filing date -
Dec 16, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In accordance with the invention, an improvement in the process for the production of a plurality of semiconductor devices from a single substrate comprises contacting at least one surface of the substrate adjacent the peripheral edge thereof with means capable of rendering the coating material into a selectively more easily removable form than the remainder of the coating material. Selective peripheral portions of the coating material are then removed which mitigates the inadvertant dislodgement of coating particles from the peripheral portion of the substrate during subsequent processing of the coated substrate. In a preferred embodiment, the coating material is removed by contacting the peripheral portions of the coated substrate with a chemical which is a solvent for the coating.
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