Testing apparatus of semiconductor wafers

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United States of America Patent

PATENT NO 4518914
SERIAL NO

06404055

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A testing apparatus of semiconductor wafers includes a base plate and a probe card including probe needles, wherein the probe card is detachably affixed to the base plate under air suction, which is derived from a vacuum produced in an airtightly sealed space provided between the base plate and the probe card.

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Patent Owner(s)

Patent OwnerAddress
JAPAN ELECTRIC MATERIALS CORPORATION167-10 AZA NOGMAI KUCHITANAKA AMAGASKI HYOGO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Garretson, Oliver R Cupertino, CA 2 76
Nakai, Fumio Amagasaki, JP 6 66
Okubo, Masao Tokyo, JP 29 622
Yoshimitsu, Yasuro Takatsuki, JP 5 339

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