Probe head arrangement for conductor line testing with at least one probe head comprising a plurality of resilient contacts
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United States of America Patent
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-
May 28, 1985
Grant Date -
N/A
app pub date -
Oct 8, 1982
filing date -
Oct 30, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A probe head arrangement for contacting a plurality of closely adjacent conductor lines 2 comprises a minimum of one probe head 3, where a plurality of fingers 4 together with a back 5 are made in one piece of monocrystalline silicon in semiconductor technique. A plurality of such probe heads 3 are composed to form a tester. At the beginning of each test it is determined which fingers 4 are to be, and are not to be placed onto the individual conductor lines 2 of a card 1 to be tested. Subsequently, the short and interruption tests can be implemented after the correlation of finger and probe head addresses with the conductor line addresses.
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