Method of fabricating an electronic circuit including an aperture through the substrate thereof
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United States of America Patent
Stats
-
Jun 4, 1985
Grant Date -
N/A
app pub date -
Dec 16, 1983
filing date -
Dec 16, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic circuit including a substrate with an aperture therethrough is manufactured by cutting one or more slots in an edge of a slab of substrate, metalizing the slotted edge of the substrate and metalizing a mating edge of a mating substrate, securing together the metalized edges of the slotted substrate and mating substrate to create an aperture through the substrate from an upper surface to a lower surface thereof and creating a printed circuit pattern on one of the upper and lower surfaces of the combined substrate and metalizing the other surface of the combined substrate including a connection to the metalized edges.
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