Wafer processing machine
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United States of America Patent
Stats
-
Jun 11, 1985
Grant Date -
N/A
app pub date -
Dec 22, 1983
filing date -
Dec 22, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A sputter coating machine (11) includes a rectilinearly translatable load-lock door (16) closing off one end of a vacuumable chamber (12). Wafers (21) to be coated are loaded and unloaded by an elevated blade (24) onto a chuck (57) carried from the inside surface of the door (16). A clamping ring (85) clamps the wafer (21) to the chuck (57) and advances the wafer (21) to the open throat of a gate-valve portion (15) of the chamber (12) into position opposite a magnetron-sputter gun (105) carried from a second door end of the chamber (12). The second door (13) is moveable away from the chamber (12) on guide rails (141) and pivotable about an axis (138) for ease of maintenance.
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