Low shrinking curable molding compositions containing a poly(acrylate)
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United States of America Patent
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Jun 18, 1985
Grant Date -
N/A
app pub date -
May 26, 1983
filing date -
May 26, 1983
priority date (Note) -
Expired
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Abstract
This invention is directed to curable molding compositions containing a mixture of a poly(acrylate); a polymerizable ethylenically unsaturated monomer which serves to crosslink the poly(acrylate) to a thermoset product; a crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one and at least one of the following: (i) a second crosslinkable vinyl monomer having a reactivity ratio (r.sub.1) with styrene of greater than one, (ii) an epoxy compound having at least one 1,2-epoxy group per molecule, and (iii) an unsaturated fatty acid ester; and a thermoplastic polymer low profile additive. The curable molding compositions exhibit improved shrink control during the curing reaction. This invention is also directed to fiber reinforced thermoset resin articles which exhibit generally improved surface appearance quality and can be produced by a rapid injection molding process from the curable molding compositions.
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