Universal circuit prototyping board
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United States of America Patent
Stats
-
Jun 18, 1985
Grant Date -
N/A
app pub date -
Aug 17, 1983
filing date -
Aug 17, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A universal multilayer circuit prototyping board is provided having a predefined universal pattern of socket pin perforations which accommodates all standard DIP integrated circuit packages at virtually any position on the board. The universal board allows high density circuit packing while maintaining excellent electrical performance with high speed circuits.
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Cited Art Landscape
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