Method for manufacturing multilayer circuit substrate
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United States of America Patent
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-
Jun 25, 1985
Grant Date -
N/A
app pub date -
Sep 8, 1982
filing date -
Sep 11, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for manufacturing a multilayer circuit substrate includes the step of providing an insulating substrate formed of an inorganic oxide and supporting a laminate formed by alternately laminating wiring layers of copper and insulating layers of an inorganic oxide. The uppermost layer of the laminate is constituted by a copper wiring layer. A layer of electrically conductive material capable of being subjected to wire bonding is formed by a low temperature deposition on the surface of the laminate. Subsequently, the conductive material layer is selectively removed by photoetching to allow the portion connected to part of the uppermost copper wiring layer to remain. In this manner, the pattern layer capable of wire bonding can be formed.
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