Method for the formation of buried gates of a semiconductor device utilizing etch and refill techniques

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United States of America Patent

PATENT NO 4528745
SERIAL NO

06511193

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Abstract

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A method for the formation of buried gates in a semiconductor device using epitaxial growing method combined with diffusion method or diffusion by an additional heat treatment. The buried gate has smaller gate resistance by providing relatively high impurity concentration and also having good reverse characteristic by providing relatively low impurity concentration at the top of the buried gates.

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Patent Owner(s)

Patent OwnerAddress
TOYO DENKI SEIZO KABUSHIKI KAISHATOKYO 103-0028

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Muraoka, Kimihiro Yokohama, JP 9 240

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