Method for encapsulating semiconductor components using temporary substrates
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United States of America Patent
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-
Jul 23, 1985
Grant Date -
N/A
app pub date -
Apr 1, 1983
filing date -
Apr 1, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In the manufacture of a semiconductor component, connection areas adapted to connect the component externally are formed by a metal array (3, 4) deposited on a conductive layer (6) of low melting point alloy, itself deposited on a metal temporary substrate (7). Each component chip (1) is placed in position and connected and then immobilized by means of a hardenable resin (5). The temporary substrate (7) is then removed by melting the alloy layer (6) to expose the surfaces of the connection areas (3, 4) for making external electrical and/or thermal connections to the encapsulated component.
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