Circuit module with enhanced heat transfer and distribution
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United States of America Patent
Stats
-
Aug 13, 1985
Grant Date -
N/A
app pub date -
Apr 22, 1983
filing date -
Apr 22, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.
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