Photoresists suitable for forming relief structures of highly heat-resistant polymers
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United States of America Patent
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Sep 10, 1985
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app pub date -
Sep 13, 1983
filing date -
Sep 13, 1982
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Abstract
Photoresists suitable for use for forming relief structures of highly heat-resistant polymers and which contain soluble polymeric precursors which carry radiation-reactive radicals bonded through carboxylic ester groups have an increased light-sensitivity when they also contain at least one radiation-reactive, polymerizable allyl compound which has a boiling point above 180.degree., the allyl group thereof being bonded via an oxygen, sulfur and/or nitrogen atom. The highly heat-resistant polymers which can be prepared by means of these photoresists have excellent chemical, electrical and mechanical properties.
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