Hybrid integrated circuit device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Sep 17, 1985
Grant Date -
N/A
app pub date -
Aug 31, 1982
filing date -
Sep 7, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and supplying welding current from the electrodes through the lead head and metal piece.
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