High density electronics packaging system for hostile environment
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United States of America Patent
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-
Oct 15, 1985
Grant Date -
N/A
app pub date -
Dec 23, 1983
filing date -
Dec 23, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronics packaging system suitable for the hostile operating environment of downhole MWD tools is disclosed which has a 'Y'-shaped cross-sectional chassis on the periphery of which are attached a plurality of electronics modules in a 'delta' configuration to give a rigid, high density assembly with convenient cabling channels running axially of the chassis. Roller supports or annular shoe supports provided on the chassis isolate the electronics from the vibration and shock forces experienced by the housing. The metal-elastomer-metal construction of the supports offers the resiliency needed for vibration dampening and shock absorption, as well as the rigidity needed for rolling and controlling the direction of application of the undissipated forces. Heat sinks are provided both above and below electronics elements to rapidly disseminate localized heat and to radiate heat generally through the housing walls to an external cooling medium.
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