Pinless connector interposer and method for making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 22, 1985
Grant Date -
N/A
app pub date -
Apr 27, 1984
filing date -
Apr 27, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pinless connector interposer for making densely populated, inexpensive, simple, reliable, self-wiping connections between components used in semiconductor packaging such as semiconductor carrying substrates, flexible and rigid printed circuit boards and cards. The connector interposer comprises an elastomeric base member in which deformable protrusions are formed on both the top and bottom surface of the base member, wherein the protrusions correspond to contact pads of semiconductor packaging components. An electrically conductive metal coated flexible overlay is bonded to the base member, forming electrically conductive tab elements, enabling a multitude of connections to be made to a semiconductor package. The connections can be accommodated on centers as low as 0.025 inches, despite the non-planarity that may exist between the packaging components of a system.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully