Evaporative cooling
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United States of America Patent
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-
Oct 29, 1985
Grant Date -
N/A
app pub date -
Apr 6, 1984
filing date -
Apr 6, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Evaporative cooling particularly useful for semiconductor integrated circuits is more efficient when a liquid is completely evaporated at the heat radiating surface. The liquid is converted to droplets and mixed with the gas at the heat radiating surface.
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