Vapor phase soldering using perfluorotetradecahydrophenanthrene (C.sub.14 F.sub.24)
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United States of America Patent
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Oct 29, 1985
Grant Date -
N/A
app pub date -
Apr 30, 1984
filing date -
May 6, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of soldering wherein a component or components to be soldered, such as a printed circuit board and soldered preforms, are immersed in a vapor bath to melt the solder, following which the components are withdrawn from the vapor bath. In the method according to the invention, the vapor bath is composed predominantly of perfluorotetradecahydrophenanthrene (C.sub.14 F.sub.24).
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