Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4551746
SERIAL NO

06505866

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized crosstalk between neighboring signal leads lying in the same plane.

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Patent Owner(s)

Patent OwnerAddress
MAYO FOUNDATION FOR MEDICAL EDUCATION AND RESEARCH200 FIRST STREET S W ROCHESTER MN 55905

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gilbert, Barry K Rochester, MN 27 702
Schwab, Daniel J Rochester, MN 7 304

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