Printed circuit board maximizing areas for component utilization
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United States of America Patent
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-
Nov 12, 1985
Grant Date -
N/A
app pub date -
Aug 30, 1983
filing date -
Aug 30, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer printed circuit board for TTL logic components provides an approximate 100 ohm characteristic impedance between external microstrip signal lines and internal ground and voltage planes. The addition of two internal microstrip signal plane lines permits a much greater interconnectability capability and also saves a large percentage of spatial area for component mounting while still maintaining the 100 ohm impedance characteristic.
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