Organic chip capacitor
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United States of America Patent
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-
Nov 26, 1985
Grant Date -
N/A
app pub date -
Jan 11, 1984
filing date -
Jan 12, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A chip film capacitor laminated at both sides with vapor coated metal electrodes and heat resistant films of heat resistant resin dielectrics, the laminated body having at both sides common metal electrode element, which is characterized by providing no lead wire and being soldered directly onto a substrate.
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