Importance

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Abstract

An apparatus for embossing a high resolution relief pattern such as a phase hologram or diffraction grating from a mold onto a thermoplastic material is disclosed. The apparatus comprises first and second adjacent disks adapted to rotate in opposite senses, the disks serving to define an embossing zone therebetween in which the circumferences of the disks exert pressure on one another. The first disk serves to transport the thermoplastic material to the embossing zone. To preheat the thermoplastic material, a preheating band of limited length is mounted under tension on the circumference of the first disk, the preheating band being resistively heated by a longitudinally flowing electric current. A resistively heated band-shaped embossing mold is mounted on the circumference of the second disk. The embossing mold and the thermoplastic carrier come into contact with one another in the embossing zone. The pressure exerted by the disks on one another in the embossing zone is sufficient to transfer the relief pattern from the heated mold to the heated thermoplastic material. A mechanism for controlling the embossing pressure is provided.

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First Claim