Importance

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Abstract

An apparatus and system for wet processing a substrate, which can be used for chemical processing such as etching or washing a semiconductor substrate are disclosed. The apparatus has a processing chamber in which the substrate is wet processed. Processing liquid is injected into the processing chamber through an opening and nozzles, and the substrate is floated in the injected liquid and rotated about its center axis by streams of the injected liquid. The wet processing system is composed from a processing apparatus as mentioned above, a water bearing system which transfers the substrate by means of a water stream, and a spin dryer. The water bearing system also serves as a washing apparatus. Shutters are provided between the water bearing and the processing chamber or the spin dryer, the shutters controlling the water levels between these elements.

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First Claim