Metallization of electrically insulating polymeric film substrates

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United States of America Patent

PATENT NO 4564424
SERIAL NO

06600833

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Abstract

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Electrically insulating polymeric film substrates are conductively metallized, e.g., to provide base members useful in the fabrication of printed circuits and the like, by (1) shaping into such film substrate an intimate homogeneous admixture of a film-forming polymer matrix having from 10 to 70 percent by total weight of said admixture of finely divided, non-conductive metal oxide particles uniformly distributed therein, (2) disrupting at least one face surface of said shaped film substrate to expose thereon a plurality of said finely divided, non-conductive metal oxide particles, (3) treating said at least one disrupted face surface with a preferably borohydride reducing agent to reduce said exposed metal oxide particles into a layer of electrically conductive free metal, whereby said at least one face surface is rendered electrically conductive, and, advantageously, (4) eletrolytically depositing a reinforcing, electrically conductive metallic overlayer atop said first layer of electrically conductive free metal.

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Patent Owner(s)

  • RHONE-POULENC RECHERCHES

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Alliot-Lugaz, Maurice Lyons, FR 1 20
Cassat, Robert Ternay, FR 20 214

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