Photosensitive resin composition

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United States of America Patent

PATENT NO 4564580
SERIAL NO

06624963

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Abstract

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Disclosed is a photosensitive resin composition comprising an aqueous dispersion or emulsion comprising components (1), (3) and (4) as indispensable components and optionally the following component (2): (1) a water-soluble saponified vinyl acetate polymer to which a styrylpyridinium or styrylquinolinium group has been added; (2) a water-dispersible or hydrophobic polymer; (3) a photo-polymerizable unsaturated compound having an ethylenically unsaturated group; and (4) a photo-polymerization initiator. This composition has excellent dispersion stability, sensitivity and resolving power and produces a hardened product having good solvent resistance, water resistance and abrasion resistance.

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Patent Owner(s)

Patent OwnerAddress
KOGYO GIJUTSUIN1-3-1 KASUMIGASEKI CHIYODA-KU TOKYO-TO
MURAKAMI SCREEN KABUSHIKI KAISHA5-3-10 YOKOKAWA SUMIDA-KU TOKYO-TO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ichimura, Kunihiro Yatabe, JP 31 545
Kaneda, Sadayoshi Tokyo, JP 1 43
Shibuya, Toru Tokyo, JP 19 142
Yamaoka, Tsuguo Funabashi, JP 34 503

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