Pre-matched module for an ultra-high frequency diode with high heat dissipation
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United States of America Patent
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Jan 21, 1986
Grant Date -
N/A
app pub date -
Nov 21, 1983
filing date -
Nov 23, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pre-matched module is provided for an ultra-high frequency diode with high heat dissipation, comprising a diode chip biassed by a connection and mounted inside a case formed by a metal base, a quartz ring and a metal cap. The base of the case comprises two fixed and metal-coated diamonds one of which has dimensions very much greater than those of the other central diamond, these two diamonds allowing the heat released by the diode to be removed to a maximum and allowing the cap to provide, because of its dimensions and those of the diamond and of the ring, good radial impedance transformation.
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