Process for making a probe for high speed integrated circuits
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 28, 1986
Issued Date -
N/A
app pub date -
Nov 19, 1984
filing date -
Aug 24, 1981
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A miniaturized probe is provided for making contact with test probe pads on an integrated circuit. The probe tips are precisely positioned on the underside of a microwave substrate board. Short wires extend through a hole in the insulating board and connect the probe tips to a conductive line on the topside of the microwave substrate board. The wires are imbedded in a potting compound which also holds the probe tips. Precise location of the probe tips is accomplished during fabrication of the probe by using depressions etched in a substrate as a mold and depositing metal in these depressions using photoresist and deposition techniques.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully