Multilayer interconnect circuitry using photoimageable dielectric
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United States of America Patent
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Jan 28, 1986
Grant Date -
N/A
app pub date -
Jun 29, 1984
filing date -
Jun 29, 1984
priority date (Note) -
Expired
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Abstract
A method of fabricating multilayer printed circuit boards using polymer thick film technology is disclosed which utilizes photoimageable dielectric material between conductive polymer thick film layers and which is capable of producing extremely small and uniformly-sized vias.
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